id	sid	tid	token	lemma	pos
8w32r496w8x	1	1	quilt	quilt	NOUN
8w32r496w8x	1	2	packaging	packaging	NOUN
8w32r496w8x	1	3	(	(	PUNCT
8w32r496w8x	1	4	qp	qp	X
8w32r496w8x	1	5	)	)	PUNCT
8w32r496w8x	1	6	is	be	AUX
8w32r496w8x	1	7	a	a	DET
8w32r496w8x	1	8	novel	novel	ADJ
8w32r496w8x	1	9	,	,	PUNCT
8w32r496w8x	1	10	high	high	ADJ
8w32r496w8x	1	11	-	-	PUNCT
8w32r496w8x	1	12	speed	speed	NOUN
8w32r496w8x	1	13	,	,	PUNCT
8w32r496w8x	1	14	direct	direct	ADJ
8w32r496w8x	1	15	interchip	interchip	NOUN
8w32r496w8x	1	16	interconnection	interconnection	NOUN
8w32r496w8x	1	17	technology	technology	NOUN
8w32r496w8x	1	18	invented	invent	VERB
8w32r496w8x	1	19	and	and	CCONJ
8w32r496w8x	1	20	developed	develop	VERB
8w32r496w8x	1	21	at	at	ADP
8w32r496w8x	1	22	the	the	DET
8w32r496w8x	1	23	university	university	PROPN
8w32r496w8x	1	24	of	of	ADP
8w32r496w8x	1	25	notre	notre	PROPN
8w32r496w8x	1	26	dame	dame	PROPN
8w32r496w8x	1	27	.	.	PUNCT
8w32r496w8x	2	1	quilt	quilt	NOUN
8w32r496w8x	2	2	packaging	packaging	NOUN
8w32r496w8x	2	3	uses	use	VERB
8w32r496w8x	2	4	conducting	conduct	VERB
8w32r496w8x	2	5	structures	structure	NOUN
8w32r496w8x	2	6	,	,	PUNCT
8w32r496w8x	2	7	called	call	VERB
8w32r496w8x	2	8	'	'	PUNCT
8w32r496w8x	2	9	nodules	nodule	NOUN
8w32r496w8x	2	10	,	,	PUNCT
8w32r496w8x	2	11	'	'	PUNCT
8w32r496w8x	2	12	that	that	PRON
8w32r496w8x	2	13	protrude	protrude	NOUN
8w32r496w8x	2	14	from	from	ADP
8w32r496w8x	2	15	the	the	DET
8w32r496w8x	2	16	thin	thin	ADJ
8w32r496w8x	2	17	,	,	PUNCT
8w32r496w8x	2	18	vertical	vertical	ADJ
8w32r496w8x	2	19	faces	face	NOUN
8w32r496w8x	2	20	of	of	ADP
8w32r496w8x	2	21	a	a	DET
8w32r496w8x	2	22	chip	chip	NOUN
8w32r496w8x	2	23	,	,	PUNCT
8w32r496w8x	2	24	connecting	connect	VERB
8w32r496w8x	2	25	to	to	ADP
8w32r496w8x	2	26	matching	match	VERB
8w32r496w8x	2	27	structures	structure	NOUN
8w32r496w8x	2	28	on	on	ADP
8w32r496w8x	2	29	an	an	DET
8w32r496w8x	2	30	adjacent	adjacent	ADJ
8w32r496w8x	2	31	chip	chip	NOUN
8w32r496w8x	2	32	,	,	PUNCT
8w32r496w8x	2	33	forming	form	VERB
8w32r496w8x	2	34	a	a	DET
8w32r496w8x	2	35	high	high	ADJ
8w32r496w8x	2	36	-	-	PUNCT
8w32r496w8x	2	37	performance	performance	NOUN
8w32r496w8x	2	38	and	and	CCONJ
8w32r496w8x	2	39	dense	dense	ADJ
8w32r496w8x	2	40	system	system	NOUN
8w32r496w8x	2	41	-	-	PUNCT
8w32r496w8x	2	42	in	in	ADP
8w32r496w8x	2	43	-	-	PUNCT
8w32r496w8x	2	44	package	package	NOUN
8w32r496w8x	2	45	.	.	PUNCT
8w32r496w8x	3	1	groups	group	NOUN
8w32r496w8x	3	2	of	of	ADP
8w32r496w8x	3	3	chips	chip	NOUN
8w32r496w8x	3	4	are	be	AUX
8w32r496w8x	3	5	tiled	tile	VERB
8w32r496w8x	3	6	much	much	ADV
8w32r496w8x	3	7	like	like	ADP
8w32r496w8x	3	8	cloth	cloth	NOUN
8w32r496w8x	3	9	pieces	piece	NOUN
8w32r496w8x	3	10	in	in	ADP
8w32r496w8x	3	11	a	a	DET
8w32r496w8x	3	12	patchwork	patchwork	NOUN
8w32r496w8x	3	13	quilt	quilt	NOUN
8w32r496w8x	3	14	,	,	PUNCT
8w32r496w8x	3	15	so	so	ADV
8w32r496w8x	3	16	a	a	DET
8w32r496w8x	3	17	group	group	NOUN
8w32r496w8x	3	18	of	of	ADP
8w32r496w8x	3	19	tiled	tiled	NOUN
8w32r496w8x	3	20	,	,	PUNCT
8w32r496w8x	3	21	or	or	CCONJ
8w32r496w8x	3	22	'	'	PUNCT
8w32r496w8x	3	23	quilted	quilt	VERB
8w32r496w8x	3	24	,	,	PUNCT
8w32r496w8x	3	25	'	'	PUNCT
8w32r496w8x	3	26	chips	chip	NOUN
8w32r496w8x	3	27	are	be	AUX
8w32r496w8x	3	28	called	call	VERB
8w32r496w8x	3	29	'	'	PUNCT
8w32r496w8x	3	30	quilts	quilt	NOUN
8w32r496w8x	3	31	'	'	PART
8w32r496w8x	3	32	or	or	CCONJ
8w32r496w8x	3	33	'	'	PUNCT
8w32r496w8x	3	34	metachips	metachip	NOUN
8w32r496w8x	3	35	.	.	PUNCT
8w32r496w8x	3	36	'	'	PUNCT
8w32r496w8x	4	1	as	as	ADP
8w32r496w8x	4	2	an	an	DET
8w32r496w8x	4	3	emerging	emerge	VERB
8w32r496w8x	4	4	technology	technology	NOUN
8w32r496w8x	4	5	,	,	PUNCT
8w32r496w8x	4	6	quilt	quilt	NOUN
8w32r496w8x	4	7	packaging	packaging	NOUN
8w32r496w8x	4	8	has	have	VERB
8w32r496w8x	4	9	novel	novel	ADJ
8w32r496w8x	4	10	failure	failure	NOUN
8w32r496w8x	4	11	modes	mode	NOUN
8w32r496w8x	4	12	that	that	PRON
8w32r496w8x	4	13	require	require	VERB
8w32r496w8x	4	14	investigation	investigation	NOUN
8w32r496w8x	4	15	.	.	PUNCT
8w32r496w8x	5	1	in	in	ADP
8w32r496w8x	5	2	this	this	DET
8w32r496w8x	5	3	work	work	NOUN
8w32r496w8x	5	4	,	,	PUNCT
8w32r496w8x	5	5	a	a	DET
8w32r496w8x	5	6	reliable	reliable	ADJ
8w32r496w8x	5	7	structure	structure	NOUN
8w32r496w8x	5	8	for	for	ADP
8w32r496w8x	5	9	quilted	quilt	VERB
8w32r496w8x	5	10	chips	chip	NOUN
8w32r496w8x	5	11	is	be	AUX
8w32r496w8x	5	12	proposed	propose	VERB
8w32r496w8x	5	13	and	and	CCONJ
8w32r496w8x	5	14	demonstrated	demonstrate	VERB
8w32r496w8x	5	15	.	.	PUNCT
8w32r496w8x	6	1	simulation	simulation	NOUN
8w32r496w8x	6	2	models	model	NOUN
8w32r496w8x	6	3	are	be	AUX
8w32r496w8x	6	4	developed	develop	VERB
8w32r496w8x	6	5	to	to	PART
8w32r496w8x	6	6	study	study	VERB
8w32r496w8x	6	7	the	the	DET
8w32r496w8x	6	8	failure	failure	NOUN
8w32r496w8x	6	9	modes	mode	NOUN
8w32r496w8x	6	10	of	of	ADP
8w32r496w8x	6	11	qp	qp	NOUN
8w32r496w8x	6	12	.	.	NOUN
8w32r496w8x	6	13	simulations	simulation	NOUN
8w32r496w8x	6	14	based	base	VERB
8w32r496w8x	6	15	on	on	ADP
8w32r496w8x	6	16	material	material	NOUN
8w32r496w8x	6	17	properties	property	NOUN
8w32r496w8x	6	18	and	and	CCONJ
8w32r496w8x	6	19	static	static	ADJ
8w32r496w8x	6	20	,	,	PUNCT
8w32r496w8x	6	21	uniform	uniform	ADJ
8w32r496w8x	6	22	temperature	temperature	NOUN
8w32r496w8x	6	23	provide	provide	VERB
8w32r496w8x	6	24	guidelines	guideline	NOUN
8w32r496w8x	6	25	for	for	ADP
8w32r496w8x	6	26	the	the	DET
8w32r496w8x	6	27	size	size	NOUN
8w32r496w8x	6	28	of	of	ADP
8w32r496w8x	6	29	interconnects	interconnect	NOUN
8w32r496w8x	6	30	and	and	CCONJ
8w32r496w8x	6	31	materials	material	NOUN
8w32r496w8x	6	32	to	to	PART
8w32r496w8x	6	33	use	use	VERB
8w32r496w8x	6	34	for	for	ADP
8w32r496w8x	6	35	a	a	DET
8w32r496w8x	6	36	reliable	reliable	ADJ
8w32r496w8x	6	37	qp	qp	NOUN
8w32r496w8x	6	38	structure	structure	NOUN
8w32r496w8x	6	39	.	.	PUNCT
8w32r496w8x	7	1	additionally	additionally	ADV
8w32r496w8x	7	2	,	,	PUNCT
8w32r496w8x	7	3	simulation	simulation	NOUN
8w32r496w8x	7	4	results	result	NOUN
8w32r496w8x	7	5	are	be	AUX
8w32r496w8x	7	6	used	use	VERB
8w32r496w8x	7	7	to	to	PART
8w32r496w8x	7	8	explore	explore	VERB
8w32r496w8x	7	9	the	the	DET
8w32r496w8x	7	10	most	most	ADV
8w32r496w8x	7	11	vulnerable	vulnerable	ADJ
8w32r496w8x	7	12	regions	region	NOUN
8w32r496w8x	7	13	of	of	ADP
8w32r496w8x	7	14	the	the	DET
8w32r496w8x	7	15	structure	structure	NOUN
8w32r496w8x	7	16	,	,	PUNCT
8w32r496w8x	7	17	and	and	CCONJ
8w32r496w8x	7	18	are	be	AUX
8w32r496w8x	7	19	verified	verify	VERB
8w32r496w8x	7	20	by	by	ADP
8w32r496w8x	7	21	experiments	experiment	NOUN
8w32r496w8x	7	22	.	.	PUNCT
8w32r496w8x	8	1	some	some	DET
8w32r496w8x	8	2	ways	way	NOUN
8w32r496w8x	8	3	of	of	ADP
8w32r496w8x	8	4	reducing	reduce	VERB
8w32r496w8x	8	5	stress	stress	NOUN
8w32r496w8x	8	6	at	at	ADP
8w32r496w8x	8	7	the	the	DET
8w32r496w8x	8	8	critical	critical	ADJ
8w32r496w8x	8	9	areas	area	NOUN
8w32r496w8x	8	10	is	be	AUX
8w32r496w8x	8	11	addressed	address	VERB
8w32r496w8x	8	12	.	.	PUNCT
8w32r496w8x	9	1	the	the	DET
8w32r496w8x	9	2	number	number	NOUN
8w32r496w8x	9	3	of	of	ADP
8w32r496w8x	9	4	failure	failure	NOUN
8w32r496w8x	9	5	cycles	cycle	NOUN
8w32r496w8x	9	6	for	for	ADP
8w32r496w8x	9	7	the	the	DET
8w32r496w8x	9	8	qp	qp	PROPN
8w32r496w8x	9	9	nodules	nodule	NOUN
8w32r496w8x	9	10	is	be	AUX
8w32r496w8x	9	11	estimated	estimate	VERB
8w32r496w8x	9	12	using	use	VERB
8w32r496w8x	9	13	simulation	simulation	NOUN
8w32r496w8x	9	14	results	result	NOUN
8w32r496w8x	9	15	and	and	CCONJ
8w32r496w8x	9	16	a	a	DET
8w32r496w8x	9	17	fatigue	fatigue	NOUN
8w32r496w8x	9	18	failure	failure	NOUN
8w32r496w8x	9	19	model	model	NOUN
8w32r496w8x	9	20	.	.	PUNCT
8w32r496w8x	10	1	test	test	NOUN
8w32r496w8x	10	2	structures	structure	NOUN
8w32r496w8x	10	3	are	be	AUX
8w32r496w8x	10	4	fabricated	fabricate	VERB
8w32r496w8x	10	5	.	.	PUNCT
8w32r496w8x	11	1	we	we	PRON
8w32r496w8x	11	2	use	use	VERB
8w32r496w8x	11	3	both	both	CCONJ
8w32r496w8x	11	4	thermal	thermal	ADJ
8w32r496w8x	11	5	cycling	cycling	NOUN
8w32r496w8x	11	6	and	and	CCONJ
8w32r496w8x	11	7	thermal	thermal	ADJ
8w32r496w8x	11	8	shock	shock	NOUN
8w32r496w8x	11	9	tests	test	NOUN
8w32r496w8x	11	10	to	to	PART
8w32r496w8x	11	11	examine	examine	VERB
8w32r496w8x	11	12	the	the	DET
8w32r496w8x	11	13	failure	failure	NOUN
8w32r496w8x	11	14	modes	mode	NOUN
8w32r496w8x	11	15	of	of	ADP
8w32r496w8x	11	16	individual	individual	ADJ
8w32r496w8x	11	17	qp	qp	NOUN
8w32r496w8x	11	18	chips	chip	NOUN
8w32r496w8x	11	19	(	(	PUNCT
8w32r496w8x	11	20	i.e.	i.e.	X
8w32r496w8x	11	21	,	,	PUNCT
8w32r496w8x	11	22	unquilted	unquilted	ADJ
8w32r496w8x	11	23	)	)	PUNCT
8w32r496w8x	11	24	as	as	ADV
8w32r496w8x	11	25	well	well	ADV
8w32r496w8x	11	26	as	as	ADP
8w32r496w8x	11	27	two	two	NUM
8w32r496w8x	11	28	-	-	PUNCT
8w32r496w8x	11	29	chip	chip	NOUN
8w32r496w8x	11	30	metachips	metachip	NOUN
8w32r496w8x	11	31	,	,	PUNCT
8w32r496w8x	11	32	focusing	focus	VERB
8w32r496w8x	11	33	on	on	ADP
8w32r496w8x	11	34	reliability	reliability	NOUN
8w32r496w8x	11	35	issues	issue	NOUN
8w32r496w8x	11	36	for	for	ADP
8w32r496w8x	11	37	various	various	ADJ
8w32r496w8x	11	38	shapes	shape	NOUN
8w32r496w8x	11	39	.	.	PUNCT
8w32r496w8x	12	1	to	to	PART
8w32r496w8x	12	2	explore	explore	VERB
8w32r496w8x	12	3	the	the	DET
8w32r496w8x	12	4	test	test	NOUN
8w32r496w8x	12	5	results	result	NOUN
8w32r496w8x	12	6	,	,	PUNCT
8w32r496w8x	12	7	both	both	CCONJ
8w32r496w8x	12	8	noninvasive	noninvasive	ADJ
8w32r496w8x	12	9	and	and	CCONJ
8w32r496w8x	12	10	invasive	invasive	ADJ
8w32r496w8x	12	11	methods	method	NOUN
8w32r496w8x	12	12	are	be	AUX
8w32r496w8x	12	13	used	use	VERB
8w32r496w8x	12	14	.	.	PUNCT
8w32r496w8x	13	1	the	the	DET
8w32r496w8x	13	2	test	test	NOUN
8w32r496w8x	13	3	results	result	NOUN
8w32r496w8x	13	4	are	be	AUX
8w32r496w8x	13	5	consistent	consistent	ADJ
8w32r496w8x	13	6	with	with	ADP
8w32r496w8x	13	7	simulation	simulation	NOUN
8w32r496w8x	13	8	results	result	NOUN
8w32r496w8x	13	9	;	;	PUNCT
8w32r496w8x	13	10	viable	viable	ADJ
8w32r496w8x	13	11	operating	operating	NOUN
8w32r496w8x	13	12	temperature	temperature	NOUN
8w32r496w8x	13	13	ranges	range	NOUN
8w32r496w8x	13	14	are	be	AUX
8w32r496w8x	13	15	also	also	ADV
8w32r496w8x	13	16	identified	identify	VERB
8w32r496w8x	13	17	.	.	PUNCT