id	sid	tid	token	lemma	pos
8s45q813m8n	1	1	an	an	DET
8s45q813m8n	1	2	interchip	interchip	NOUN
8s45q813m8n	1	3	interconnection	interconnection	NOUN
8s45q813m8n	1	4	approach	approach	NOUN
8s45q813m8n	1	5	based	base	VERB
8s45q813m8n	1	6	on	on	ADP
8s45q813m8n	1	7	a	a	DET
8s45q813m8n	1	8	new	new	ADJ
8s45q813m8n	1	9	2	2	NUM
8s45q813m8n	1	10	-	-	PUNCT
8s45q813m8n	1	11	d	d	NOUN
8s45q813m8n	1	12	system	system	NOUN
8s45q813m8n	1	13	-	-	PUNCT
8s45q813m8n	1	14	in	in	ADP
8s45q813m8n	1	15	-	-	PUNCT
8s45q813m8n	1	16	package	package	NOUN
8s45q813m8n	1	17	(	(	PUNCT
8s45q813m8n	1	18	sip	sip	VERB
8s45q813m8n	1	19	)	)	PUNCT
8s45q813m8n	1	20	method?quilt	method?quilt	PROPN
8s45q813m8n	1	21	packaging	packaging	NOUN
8s45q813m8n	1	22	(	(	PUNCT
8s45q813m8n	1	23	qp	qp	NOUN
8s45q813m8n	1	24	)	)	PUNCT
8s45q813m8n	1	25	,	,	PUNCT
8s45q813m8n	1	26	invented	invent	VERB
8s45q813m8n	1	27	at	at	ADP
8s45q813m8n	1	28	the	the	DET
8s45q813m8n	1	29	university	university	PROPN
8s45q813m8n	1	30	of	of	ADP
8s45q813m8n	1	31	notre	notre	PROPN
8s45q813m8n	1	32	dame	dame	NOUN
8s45q813m8n	1	33	,	,	PUNCT
8s45q813m8n	1	34	is	be	AUX
8s45q813m8n	1	35	discussed	discuss	VERB
8s45q813m8n	1	36	.	.	PUNCT
8s45q813m8n	2	1	the	the	DET
8s45q813m8n	2	2	principal	principal	ADJ
8s45q813m8n	2	3	idea	idea	NOUN
8s45q813m8n	2	4	of	of	ADP
8s45q813m8n	2	5	qp	qp	NOUN
8s45q813m8n	2	6	is	be	AUX
8s45q813m8n	2	7	to	to	PART
8s45q813m8n	2	8	assemble	assemble	VERB
8s45q813m8n	2	9	a	a	DET
8s45q813m8n	2	10	planar	planar	ADJ
8s45q813m8n	2	11	mosaic	mosaic	ADJ
8s45q813m8n	2	12	,	,	PUNCT
8s45q813m8n	2	13	or	or	CCONJ
8s45q813m8n	2	14	?	?	PUNCT
8s45q813m8n	2	15	quilt	quilt	NOUN
8s45q813m8n	2	16	,	,	PUNCT
8s45q813m8n	2	17	?	?	PUNCT
8s45q813m8n	3	1	of	of	ADP
8s45q813m8n	3	2	dies	die	NOUN
8s45q813m8n	3	3	interconnected	interconnect	VERB
8s45q813m8n	3	4	by	by	ADP
8s45q813m8n	3	5	conductive	conductive	ADJ
8s45q813m8n	3	6	nodules	nodule	NOUN
8s45q813m8n	3	7	that	that	PRON
8s45q813m8n	3	8	protrude	protrude	VERB
8s45q813m8n	3	9	from	from	ADP
8s45q813m8n	3	10	vertical	vertical	ADJ
8s45q813m8n	3	11	faces	face	NOUN
8s45q813m8n	3	12	of	of	ADP
8s45q813m8n	3	13	ics	ics	PROPN
8s45q813m8n	3	14	.	.	PUNCT
8s45q813m8n	4	1	qp	qp	PROPN
8s45q813m8n	4	2	offers	offer	VERB
8s45q813m8n	4	3	reduced	reduce	VERB
8s45q813m8n	4	4	delay	delay	NOUN
8s45q813m8n	4	5	,	,	PUNCT
8s45q813m8n	4	6	ultrawide	ultrawide	ADJ
8s45q813m8n	4	7	bandwidth	bandwidth	ADJ
8s45q813m8n	4	8	,	,	PUNCT
8s45q813m8n	4	9	low	low	ADJ
8s45q813m8n	4	10	electrical	electrical	ADJ
8s45q813m8n	4	11	noise	noise	NOUN
8s45q813m8n	4	12	,	,	PUNCT
8s45q813m8n	4	13	decreased	decrease	VERB
8s45q813m8n	4	14	system	system	NOUN
8s45q813m8n	4	15	size	size	NOUN
8s45q813m8n	4	16	and	and	CCONJ
8s45q813m8n	4	17	weight	weight	NOUN
8s45q813m8n	4	18	,	,	PUNCT
8s45q813m8n	4	19	and	and	CCONJ
8s45q813m8n	4	20	the	the	DET
8s45q813m8n	4	21	opportunity	opportunity	NOUN
8s45q813m8n	4	22	for	for	ADP
8s45q813m8n	4	23	heterogeneous	heterogeneous	ADJ
8s45q813m8n	4	24	integration	integration	NOUN
8s45q813m8n	4	25	.	.	PUNCT
8s45q813m8n	5	1	in	in	ADP
8s45q813m8n	5	2	this	this	DET
8s45q813m8n	5	3	dissertation	dissertation	NOUN
8s45q813m8n	5	4	,	,	PUNCT
8s45q813m8n	5	5	modifications	modification	NOUN
8s45q813m8n	5	6	to	to	ADP
8s45q813m8n	5	7	previous	previous	ADJ
8s45q813m8n	5	8	qp	qp	NOUN
8s45q813m8n	5	9	fabrication	fabrication	NOUN
8s45q813m8n	5	10	processes	process	NOUN
8s45q813m8n	5	11	are	be	AUX
8s45q813m8n	5	12	introduced	introduce	VERB
8s45q813m8n	5	13	.	.	PUNCT
8s45q813m8n	6	1	a	a	DET
8s45q813m8n	6	2	new	new	ADJ
8s45q813m8n	6	3	joining	joining	NOUN
8s45q813m8n	6	4	method	method	NOUN
8s45q813m8n	6	5	for	for	ADP
8s45q813m8n	6	6	qp	qp	NOUN
8s45q813m8n	6	7	interconnection	interconnection	NOUN
8s45q813m8n	6	8	is	be	AUX
8s45q813m8n	6	9	presented	present	VERB
8s45q813m8n	6	10	,	,	PUNCT
8s45q813m8n	6	11	using	use	VERB
8s45q813m8n	6	12	solder	solder	NOUN
8s45q813m8n	6	13	paste	paste	NOUN
8s45q813m8n	6	14	applied	apply	VERB
8s45q813m8n	6	15	with	with	ADP
8s45q813m8n	6	16	the	the	DET
8s45q813m8n	6	17	pin	pin	NOUN
8s45q813m8n	6	18	transfer	transfer	NOUN
8s45q813m8n	6	19	method	method	NOUN
8s45q813m8n	6	20	,	,	PUNCT
8s45q813m8n	6	21	which	which	PRON
8s45q813m8n	6	22	greatly	greatly	ADV
8s45q813m8n	6	23	improves	improve	VERB
8s45q813m8n	6	24	mechanical	mechanical	ADJ
8s45q813m8n	6	25	and	and	CCONJ
8s45q813m8n	6	26	thermal	thermal	ADJ
8s45q813m8n	6	27	reliability	reliability	NOUN
8s45q813m8n	6	28	,	,	PUNCT
8s45q813m8n	6	29	and	and	CCONJ
8s45q813m8n	6	30	manufacturability	manufacturability	NOUN
8s45q813m8n	6	31	.	.	PUNCT
8s45q813m8n	7	1	chip	chip	NOUN
8s45q813m8n	7	2	-	-	PUNCT
8s45q813m8n	7	3	to	to	ADP
8s45q813m8n	7	4	-	-	PUNCT
8s45q813m8n	7	5	chip	chip	NOUN
8s45q813m8n	7	6	alignment	alignment	NOUN
8s45q813m8n	7	7	offsets	offset	VERB
8s45q813m8n	7	8	smaller	small	ADJ
8s45q813m8n	7	9	than	than	ADP
8s45q813m8n	7	10	1	1	NUM
8s45q813m8n	7	11	?	?	NUM
8s45q813m8n	7	12	m	m	VERB
8s45q813m8n	7	13	are	be	AUX
8s45q813m8n	7	14	demonstrated	demonstrate	VERB
8s45q813m8n	7	15	.	.	PUNCT
8s45q813m8n	8	1	simulations	simulation	NOUN
8s45q813m8n	8	2	and	and	CCONJ
8s45q813m8n	8	3	measurements	measurement	NOUN
8s45q813m8n	8	4	indicate	indicate	VERB
8s45q813m8n	8	5	that	that	SCONJ
8s45q813m8n	8	6	the	the	DET
8s45q813m8n	8	7	microwave	microwave	NOUN
8s45q813m8n	8	8	performance	performance	NOUN
8s45q813m8n	8	9	of	of	ADP
8s45q813m8n	8	10	qp	qp	NOUN
8s45q813m8n	8	11	interconnects	interconnect	NOUN
8s45q813m8n	8	12	provides	provide	VERB
8s45q813m8n	8	13	ultrawide	ultrawide	ADJ
8s45q813m8n	8	14	bandwidth	bandwidth	ADJ
8s45q813m8n	8	15	.	.	PUNCT
8s45q813m8n	9	1	moreover	moreover	ADV
8s45q813m8n	9	2	,	,	PUNCT
8s45q813m8n	9	3	the	the	DET
8s45q813m8n	9	4	use	use	NOUN
8s45q813m8n	9	5	of	of	ADP
8s45q813m8n	9	6	solder	solder	NOUN
8s45q813m8n	9	7	paste	paste	NOUN
8s45q813m8n	9	8	does	do	AUX
8s45q813m8n	9	9	not	not	PART
8s45q813m8n	9	10	significantly	significantly	ADV
8s45q813m8n	9	11	degrade	degrade	VERB
8s45q813m8n	9	12	the	the	DET
8s45q813m8n	9	13	microwave	microwave	NOUN
8s45q813m8n	9	14	performance	performance	NOUN
8s45q813m8n	9	15	of	of	ADP
8s45q813m8n	9	16	qp	qp	NOUN
8s45q813m8n	9	17	.	.	PROPN
8s45q813m8n	9	18	in	in	ADP
8s45q813m8n	9	19	particular	particular	ADJ
8s45q813m8n	9	20	,	,	PUNCT
8s45q813m8n	9	21	the	the	DET
8s45q813m8n	9	22	return	return	NOUN
8s45q813m8n	9	23	loss	loss	NOUN
8s45q813m8n	9	24	associated	associate	VERB
8s45q813m8n	9	25	with	with	ADP
8s45q813m8n	9	26	the	the	DET
8s45q813m8n	9	27	chip	chip	NOUN
8s45q813m8n	9	28	-	-	PUNCT
8s45q813m8n	9	29	to	to	ADP
8s45q813m8n	9	30	-	-	PUNCT
8s45q813m8n	9	31	chip	chip	NOUN
8s45q813m8n	9	32	qp	qp	NOUN
8s45q813m8n	9	33	nodules	nodule	NOUN
8s45q813m8n	9	34	is	be	AUX
8s45q813m8n	9	35	better	well	ADJ
8s45q813m8n	9	36	than	than	ADP
8s45q813m8n	9	37	12.5	12.5	NUM
8s45q813m8n	9	38	db	db	NOUN
8s45q813m8n	9	39	,	,	PUNCT
8s45q813m8n	9	40	and	and	CCONJ
8s45q813m8n	9	41	the	the	DET
8s45q813m8n	9	42	insertion	insertion	NOUN
8s45q813m8n	9	43	loss	loss	NOUN
8s45q813m8n	9	44	is	be	AUX
8s45q813m8n	9	45	better	well	ADJ
8s45q813m8n	9	46	than	than	ADP
8s45q813m8n	9	47	0.8	0.8	NUM
8s45q813m8n	9	48	db	db	NOUN
8s45q813m8n	9	49	,	,	PUNCT
8s45q813m8n	9	50	at	at	ADP
8s45q813m8n	9	51	frequencies	frequency	NOUN
8s45q813m8n	9	52	up	up	ADP
8s45q813m8n	9	53	to	to	ADP
8s45q813m8n	9	54	110	110	NUM
8s45q813m8n	9	55	ghz	ghz	NOUN
8s45q813m8n	9	56	.	.	PUNCT
8s45q813m8n	10	1	mechanical	mechanical	ADJ
8s45q813m8n	10	2	and	and	CCONJ
8s45q813m8n	10	3	thermal	thermal	ADJ
8s45q813m8n	10	4	reliability	reliability	NOUN
8s45q813m8n	10	5	testing	testing	NOUN
8s45q813m8n	10	6	were	be	AUX
8s45q813m8n	10	7	performed	perform	VERB
8s45q813m8n	10	8	on	on	ADP
8s45q813m8n	10	9	qp	qp	NOUN
8s45q813m8n	10	10	,	,	PUNCT
8s45q813m8n	10	11	including	include	VERB
8s45q813m8n	10	12	pull	pull	NOUN
8s45q813m8n	10	13	and	and	CCONJ
8s45q813m8n	10	14	thermal	thermal	ADJ
8s45q813m8n	10	15	shock	shock	NOUN
8s45q813m8n	10	16	tests	test	NOUN
8s45q813m8n	10	17	.	.	PUNCT
8s45q813m8n	11	1	a	a	DET
8s45q813m8n	11	2	novel	novel	ADJ
8s45q813m8n	11	3	mechanical	mechanical	ADJ
8s45q813m8n	11	4	testing	testing	NOUN
8s45q813m8n	11	5	system	system	NOUN
8s45q813m8n	11	6	that	that	PRON
8s45q813m8n	11	7	combines	combine	VERB
8s45q813m8n	11	8	a	a	DET
8s45q813m8n	11	9	force	force	NOUN
8s45q813m8n	11	10	gauge	gauge	NOUN
8s45q813m8n	11	11	and	and	CCONJ
8s45q813m8n	11	12	a	a	DET
8s45q813m8n	11	13	micropull	micropull	ADJ
8s45q813m8n	11	14	tester	tester	NOUN
8s45q813m8n	11	15	was	be	AUX
8s45q813m8n	11	16	designed	design	VERB
8s45q813m8n	11	17	and	and	CCONJ
8s45q813m8n	11	18	constructed	construct	VERB
8s45q813m8n	11	19	.	.	PUNCT
8s45q813m8n	12	1	pull	pull	VERB
8s45q813m8n	12	2	tests	test	NOUN
8s45q813m8n	12	3	were	be	AUX
8s45q813m8n	12	4	used	use	VERB
8s45q813m8n	12	5	to	to	PART
8s45q813m8n	12	6	investigate	investigate	VERB
8s45q813m8n	12	7	the	the	DET
8s45q813m8n	12	8	mechanical	mechanical	ADJ
8s45q813m8n	12	9	strength	strength	NOUN
8s45q813m8n	12	10	of	of	ADP
8s45q813m8n	12	11	qp	qp	NOUN
8s45q813m8n	12	12	,	,	PUNCT
8s45q813m8n	12	13	and	and	CCONJ
8s45q813m8n	12	14	it	it	PRON
8s45q813m8n	12	15	is	be	AUX
8s45q813m8n	12	16	found	find	VERB
8s45q813m8n	12	17	that	that	SCONJ
8s45q813m8n	12	18	individual	individual	ADJ
8s45q813m8n	12	19	nodules	nodule	NOUN
8s45q813m8n	12	20	are	be	AUX
8s45q813m8n	12	21	about	about	ADV
8s45q813m8n	12	22	as	as	ADV
8s45q813m8n	12	23	strong	strong	ADJ
8s45q813m8n	12	24	as	as	ADP
8s45q813m8n	12	25	individual	individual	ADJ
8s45q813m8n	12	26	wirebonds	wirebond	NOUN
8s45q813m8n	12	27	,	,	PUNCT
8s45q813m8n	12	28	but	but	CCONJ
8s45q813m8n	12	29	acting	act	VERB
8s45q813m8n	12	30	together	together	ADV
8s45q813m8n	12	31	require	require	VERB
8s45q813m8n	12	32	several	several	ADJ
8s45q813m8n	12	33	pounds	pound	NOUN
8s45q813m8n	12	34	of	of	ADP
8s45q813m8n	12	35	force	force	NOUN
8s45q813m8n	12	36	to	to	PART
8s45q813m8n	12	37	separate	separate	VERB
8s45q813m8n	12	38	the	the	DET
8s45q813m8n	12	39	chips	chip	NOUN
8s45q813m8n	12	40	.	.	PUNCT
8s45q813m8n	13	1	investigations	investigation	NOUN
8s45q813m8n	13	2	were	be	AUX
8s45q813m8n	13	3	conducted	conduct	VERB
8s45q813m8n	13	4	to	to	PART
8s45q813m8n	13	5	learn	learn	VERB
8s45q813m8n	13	6	the	the	DET
8s45q813m8n	13	7	effects	effect	NOUN
8s45q813m8n	13	8	of	of	ADP
8s45q813m8n	13	9	thermal	thermal	ADJ
8s45q813m8n	13	10	shock	shock	NOUN
8s45q813m8n	13	11	on	on	ADP
8s45q813m8n	13	12	all	all	DET
8s45q813m8n	13	13	components	component	NOUN
8s45q813m8n	13	14	of	of	ADP
8s45q813m8n	13	15	the	the	DET
8s45q813m8n	13	16	nodule	nodule	NOUN
8s45q813m8n	13	17	system	system	NOUN
8s45q813m8n	13	18	,	,	PUNCT
8s45q813m8n	13	19	including	include	VERB
8s45q813m8n	13	20	the	the	DET
8s45q813m8n	13	21	inter	inter	ADJ
8s45q813m8n	13	22	-	-	ADJ
8s45q813m8n	13	23	nodule	nodule	ADJ
8s45q813m8n	13	24	solder	solder	NOUN
8s45q813m8n	13	25	,	,	PUNCT
8s45q813m8n	13	26	the	the	DET
8s45q813m8n	13	27	copper	copper	NOUN
8s45q813m8n	13	28	nodule	nodule	VERB
8s45q813m8n	13	29	itself	itself	PRON
8s45q813m8n	13	30	,	,	PUNCT
8s45q813m8n	13	31	and	and	CCONJ
8s45q813m8n	13	32	the	the	DET
8s45q813m8n	13	33	nodule	nodule	NOUN
8s45q813m8n	13	34	-	-	PUNCT
8s45q813m8n	13	35	to	to	ADP
8s45q813m8n	13	36	-	-	PUNCT
8s45q813m8n	13	37	substrate	substrate	NOUN
8s45q813m8n	13	38	interface	interface	NOUN
8s45q813m8n	13	39	layers	layer	NOUN
8s45q813m8n	13	40	.	.	PUNCT
8s45q813m8n	14	1	pull	pull	VERB
8s45q813m8n	14	2	tests	test	NOUN
8s45q813m8n	14	3	were	be	AUX
8s45q813m8n	14	4	performed	perform	VERB
8s45q813m8n	14	5	after	after	ADP
8s45q813m8n	14	6	thermal	thermal	ADJ
8s45q813m8n	14	7	shock	shock	NOUN
8s45q813m8n	14	8	testing	testing	NOUN
8s45q813m8n	14	9	,	,	PUNCT
8s45q813m8n	14	10	and	and	CCONJ
8s45q813m8n	14	11	it	it	PRON
8s45q813m8n	14	12	was	be	AUX
8s45q813m8n	14	13	found	find	VERB
8s45q813m8n	14	14	that	that	SCONJ
8s45q813m8n	14	15	during	during	ADP
8s45q813m8n	14	16	the	the	DET
8s45q813m8n	14	17	first	first	ADJ
8s45q813m8n	14	18	200	200	NUM
8s45q813m8n	14	19	thermal	thermal	ADJ
8s45q813m8n	14	20	shock	shock	NOUN
8s45q813m8n	14	21	cycles	cycle	NOUN
8s45q813m8n	14	22	,	,	PUNCT
8s45q813m8n	14	23	the	the	DET
8s45q813m8n	14	24	pull	pull	NOUN
8s45q813m8n	14	25	force	force	NOUN
8s45q813m8n	14	26	at	at	ADP
8s45q813m8n	14	27	failure	failure	NOUN
8s45q813m8n	14	28	drops	drop	VERB
8s45q813m8n	14	29	significantly	significantly	ADV
8s45q813m8n	14	30	,	,	PUNCT
8s45q813m8n	14	31	but	but	CCONJ
8s45q813m8n	14	32	has	have	VERB
8s45q813m8n	14	33	little	little	ADJ
8s45q813m8n	14	34	effect	effect	NOUN
8s45q813m8n	14	35	on	on	ADP
8s45q813m8n	14	36	the	the	DET
8s45q813m8n	14	37	tensile	tensile	NOUN
8s45q813m8n	14	38	strength	strength	NOUN
8s45q813m8n	14	39	of	of	ADP
8s45q813m8n	14	40	copper	copper	NOUN
8s45q813m8n	14	41	.	.	PUNCT
8s45q813m8n	15	1	the	the	DET
8s45q813m8n	15	2	adhesion	adhesion	NOUN
8s45q813m8n	15	3	between	between	ADP
8s45q813m8n	15	4	copper	copper	NOUN
8s45q813m8n	15	5	and	and	CCONJ
8s45q813m8n	15	6	oxide	oxide	NOUN
8s45q813m8n	15	7	is	be	AUX
8s45q813m8n	15	8	more	more	ADV
8s45q813m8n	15	9	vulnerable	vulnerable	ADJ
8s45q813m8n	15	10	to	to	ADP
8s45q813m8n	15	11	thermal	thermal	ADJ
8s45q813m8n	15	12	shock	shock	NOUN
8s45q813m8n	15	13	testing	testing	NOUN
8s45q813m8n	15	14	,	,	PUNCT
8s45q813m8n	15	15	and	and	CCONJ
8s45q813m8n	15	16	cracks	crack	NOUN
8s45q813m8n	15	17	were	be	AUX
8s45q813m8n	15	18	observed	observe	VERB
8s45q813m8n	15	19	in	in	ADP
8s45q813m8n	15	20	the	the	DET
8s45q813m8n	15	21	sidewall	sidewall	NOUN
8s45q813m8n	15	22	sio2	sio2	VERB
8s45q813m8n	15	23	isolation	isolation	NOUN
8s45q813m8n	15	24	layer	layer	NOUN
8s45q813m8n	15	25	after	after	ADP
8s45q813m8n	15	26	thermal	thermal	ADJ
8s45q813m8n	15	27	shock	shock	NOUN
8s45q813m8n	15	28	testing	testing	NOUN
8s45q813m8n	15	29	.	.	PUNCT