id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
zc77sn03s81	Umamaheswara Rao Tida	Through-Silicon-Via Inductor in Three-Dimensional Integrated Circuits: Modeling and Design for On-Chip Applications	2019		.txt	text/plain	273	13	44	However, different from conventional 2-D spiral inductors, TSV inductors are fully buried in the lossy substrate, thus suffering from low quality factor at high frequencies. Towards this, we propose to use TSV inductor instead of the spiral inductor to reduce the inductor area overhead.	cache/zc77sn03s81.txt	txt/zc77sn03s81.txt