id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
8w32r496w8x	Mohammad Ashraf Ali Khan	Thermomechanical Effects in Quilt Packaging	2014		.txt	text/plain	256	14	51	We use both thermal cycling and thermal shock tests to examine the failure modes of individual QP chips (i.e., unquilted) as well as two-chip metachips, focusing on reliability issues for various shapes. In this work, a reliable structure for quilted chips is proposed and demonstrated.	cache/8w32r496w8x.txt	txt/8w32r496w8x.txt