id	author	title	date	pages	extension	mime	words	sentences	flesch	summary	cache	txt
cord-022504-tk7v4hoj	nan	Environmental and safety issues with nanoparticles	2012-03-16		.txt	text/plain	14097	709	52	During the process, large volumes of ultrapure water are consumed to clean the surface of the wafer, which generates large quantity of CMP wastewater typically having high solid content resulting from slurry abrasive particles of SiO 2 , Al 2 O 3 , or CeO 2 , depending on the nature of the CMP application. 7.2.6.2 Industrial processes with cleanrooms Cleanrooms and associated controlled environments (e.g., in the case of an ISO Class 3 cleanroom, the maximum permissible airborne particle concentration is less than 10 3 particles/m 3 for particles with the size of 0.1 m or larger, while the airborne particle concentration in ordinary indoor environments is on the order of 10 9 particles/m 3 or higher) are usually adopted to avoid particle contamination in industrial processes where precision products such as engineered nanoparticles, semiconductors, and other electronic or optical devices are fabricated because the deposition of particles onto product surfaces causes their yield reduction and quality deterioration.	./cache/cord-022504-tk7v4hoj.txt	./txt/cord-022504-tk7v4hoj.txt