id	author	title	date	pages	extension	mime	words	sentences	flesch	summary	cache	txt
work_ipiws624y5eqlj7gicp7wnutp4	C.L. Yang	Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer	2012	1	.pdf	application/pdf	568	36	47	Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules Directly coating a GeTe(Pb) thermoelectric device with a Ni barrier layer and an Ag reaction layer and then diffusion soldering with a Cu electrode coated between the GeTe(Pb) thermoelectric material and Ni barrier layer, reducing Key words: Diffusion soldering, GeTe(Pb) thermoelectric modules, employed for the bonding of thermoelectric materials Although soldering at lower temperature can reduce thermal stress, the bonding thermoelectric modules at high temperature. Unfortunately, while the bonded thermoelectric modules are cooling from the high temperature In the alternative method, the thermoelectric modules should be bonded at a temperature as low as higher than the working temperature of thermoelectric devices. A novel bonding technique, called diffusion soldering, uses the principle of thin-film solid–liquid thin-film interlayer (LT) that melts at low temperature and reacts rapidly with the sandwiched highmelting-point (HT-1 and HT-2) layers or with the a low bonding temperature.	./cache/work_ipiws624y5eqlj7gicp7wnutp4.pdf	./txt/work_ipiws624y5eqlj7gicp7wnutp4.txt